OPA322SAIDBVT datasheet(8/61 Pages) TI2

8 / 61 page

OPA322, OPA322S

OPA2322, OPA2322S

OPA4322, OPA4322S

SBOS538F – JANUARY 2011 – REVISED DECEMBER 2016

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Product Folder Links: OPA322 OPA322S OPA2322 OPA2322S OPA4322 OPA4322S

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA322, OPA322S

THERMAL METRIC(1)

OPA322

OPA322S

UNITS

DBV (SOT-23)

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

219.3

177.5

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

107.5

108.9

°C/W

RθJB

Junction-to-board thermal resistance

57.5

27.4

°C/W

ψJT

Junction-to-top characterization parameter

7.4

13.3

°C/W

ψJB

Junction-to-board characterization parameter

56.9

26.9

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2322, OPA2322S

THERMAL METRIC(1)

OPA2322

OPA2322S

UNITS

D (SOIC)

DRG (SON)

DGK (VSSOP)

DGS

(VSSOP)

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

122.6

50.6

174.8

171.5

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

67.1

54.9

43.9

°C/W

RθJB

Junction-to-board thermal resistance

25.2

91.4

°C/W

ψJT

Junction-to-top characterization parameter

13.2

0.6

1.9

°C/W

ψJB

Junction-to-board characterization parameter

63.4

25.3

93.5

89.9

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

—

5.7

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4322, OPA4322S

THERMAL METRIC(1)

OPA4322

OPA4322S

UNITS

PW (TSSOP)

14 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

109.8

105.9

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

34.9

28.1

°C/W

RθJB

Junction-to-board thermal resistance

52.5

51.1

°C/W

ψJT

Junction-to-top characterization parameter

2.2

0.8

°C/W

ψJB

Junction-to-board characterization parameter

51.8

50.4

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

—

°C/W

OPA322SAIDBVT Datasheet(PDF) 8 Page - Texas Instruments

OPA322SAIDBVT Datasheet(HTML) 8 Page - Texas Instruments

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