PCM5100A, PCM5101A, PCM5102A

PCM5100A-Q1, PCM5101A-Q1, PCM5102A-Q1

SLAS859C – MAY 2012 – REVISED MAY 2015

www.ti.com

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVDD, CPVDD, DVDD

–0.3

3.9

Supply voltage

LDO with DVDD at 1.8 V

–0.3

2.25

DVDD at 1.8 V

–0.3

2.25

V

Digital input voltage

DVDD at 3.3 V

–0.3

3.9

Analog input voltage

–0.3

3.9

Operating junction temperature range

–40

130

°C

Storage temperature, Tstg

–65

150

°C

8.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±750

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VCOM mode

3

3.3

3.46

Referenced to

AVDD

Analog power supply voltage range

V

AGND(1)

VREF mode

3.2

3.3

3.46

1.8 V DVDD

1.65

1.8

1.95

Referenced to

DVDD

Digital power supply voltage range

V

DGND(1)

3.3 V DVDD

3.1

3.3

3.46

CPVDD

Charge pump supply voltage range

Referenced to CPGND(1)

3.1

3.3

3.46

V

MCLK

Master clock frequency

50

MHz

LOL, LOR

Stereo line output load resistance

1

10

k

Ω

CLOUT

Digital output load capacitance

10

pF

TJ

Operating junction temperature range

–40

130

°C

(1)

All grounds on board are tied together; they must not differ in voltage by more than 0.2 V max, for any combination of ground signals.

8.4 Thermal Information

PW

THERMAL METRIC(1)

UNIT

20 PINS

RθJA

Junction-to-ambient thermal resistance

91.2

RθJC(top)

Junction-to-case (top) thermal resistance

25.3

RθJB

Junction-to-board thermal resistance

42

°C/W

ψJT

Junction-to-top characterization parameter

1

ψJB

Junction-to-board characterization parameter

41.5

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6

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