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TLV369 Datasheet(PDF) 16 Page - Texas Instruments

Part # TLV369
Description  TLVx369 Cost-Optimized, 800-nA, 1.8-V, Rail-to-Rail I/O Operational Amplifier with Zero-Crossover Distortion
PDF  31 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TLV369 Datasheet(HTML) 16 Page - Texas Instruments

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+
VIN
VOUT
RG
RF
Copyright © 2016, Texas Instruments Incorporated
±IN
+IN
V±
VS+
GND
VS±
GND
VOUT
VIN
Run the input traces as
far away from the supply
lines as possible.
Use a low-ESR, ceramic
bypass capacitor.
RF
RG
Place components close to the device and
to each other to reduce parasitic errors.
Use a low-ESR,
ceramic bypass
capacitor.
OUT
V+
Copyright © 2016, Texas Instruments Incorporated
16
TLV369, TLV2369
SBOS757 – MAY 2016
www.ti.com
Product Folder Links: TLV369 TLV2369
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
10 Layout
10.1 Layout Guidelines
For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
•
Noise can propagate into analog circuitry through the power pins of the circuit as a whole and the
operational amplifier. Use bypass capacitors to reduce the coupled noise by providing low-impedance
power sources local to the analog circuitry.
–
Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
•
Separate grounding for analog and digital portions of the circuitry is one of the simplest and most
effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to
ground planes. A ground plane helps distribute heat and reduces electromagnetic interference (EMI)
noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of
the ground current. For more detailed information, see Circuit Board Layout Techniques, SLOA089.
•
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as
possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicularly is much
better than crossing in parallel with the noisy trace.
•
Place the external components as close to the device as possible. Keep RF and RG close to the inverting
input in order to minimize parasitic capacitance, as shown in Figure 19.
•
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
•
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly
reduce leakage currents from nearby traces that are at different potentials.
10.2 Layout Example
Figure 19. Operational Amplifier Board Layout for Noninverting Configuration
Figure 20. Schematic Representation of Figure 19



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