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TLV369, TLV2369

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SBOS757 – MAY 2016

Product Folder Links: TLV369 TLV2369

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Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information: TLV369

THERMAL METRIC(1)

TLV369

UNIT

DCK (SC70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

293.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

95.2

°C/W

RθJB

Junction-to-board thermal resistance

83.4

°C/W

ψJT

Junction-to-top characterization parameter

2.9

°C/W

ψJB

Junction-to-board characterization parameter

82.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Thermal Information: TLV2369

THERMAL METRIC(1)

TLV2369

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

121.5

168.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

66.3

58.1

°C/W

RθJB

Junction-to-board thermal resistance

62.5

88.9

°C/W

ψJT

Junction-to-top characterization parameter

22.8

9.3

°C/W

ψJB

Junction-to-board characterization parameter

61.9

87.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W