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TLV62080, TLV62084, TLV62084A

www.ti.com

SLVSAK9H – OCTOBER 2011 – REVISED JANUARY 2017

Product Folder Links: TLV62080 TLV62084 TLV62084A

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Copyright © 2011–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

While switching.

7 Specifications

7.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Voltage range(2)

VIN, PG, VOS

– 0.3

7

V

SW

– 0.3

VIN + 0.3

V

SW (AC, less than 10 ns)(3)

– 3.0

10

V

FB

– 0.3

3.6

V

EN

– 0.3

VIN + 0.3

V

Power Good Sink Current

PG

1

mA

Operating junction temperature range, TJ

– 40

150

°C

Storage temperature range, Tstg

– 65

150

°C

(1)

Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe

manufacturing with a standard ESD control process.

(2)

Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe

manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM) ESD stress voltage(1)

±2000

V

Charged device model (CDM) ESD stress voltage(2)

±500

V

(1)

Refer to the Application Information section for further information.

7.3 Recommended Operating Conditions

(1)

MIN

TYP

MAX

UNIT

VIN

Input voltage range, TLV62080

2.5

6

V

VIN

Input voltage range, TLV62084, TLV62084A

2.7

6

V

TJ

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

TLV6208x

DSG

(8 PINS)

UNITS

θJA

Junction-to-ambient thermal resistance

59.7

°C/W

θJCtop

Junction-to-case (top) thermal resistance

70.1

°C/W

θJB

Junction-to-board thermal resistance

30.9

°C/W

ψJT

Junction-to-top characterization parameter

1.4

°C/W

ψJB

Junction-to-board characterization parameter

31.5

°C/W

θJCbot

Junction-to-case (bottom) thermal resistance

8.6

°C/W