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TLV7021 Datasheet(PDF) 6 Page - Texas Instruments

Part # TLV7021
Description  TLV701x and TLV702x Small-Size, Low-Power, Low-Voltage Comparators
PDF  52 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TLV7021 Datasheet(HTML) 6 Page - Texas Instruments

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TLV7011, TLV7021, TLV7012, TLV7022
SLVSDM5F – SEPTEMBER 2017 – REVISED MARCH 2020
www.ti.com
Product Folder Links: TLV7011 TLV7021 TLV7012 TLV7022
Submit Documentation Feedback
Copyright © 2017–2020, Texas Instruments Incorporated
6.5 Recommended Operating Conditions (Dual)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Supply voltage VS = VCC – VEE
1.6
6.5
V
Input voltage range
VCC – 0.1
VEE + 0.2
V
Ambient temperature, TA
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.6 Thermal Information (Single)
THERMAL METRIC(1)
TLV7011/TLV7021
UNIT
DPW (X2SON)
DBV (SOT23)
DCK (SC70)
5 PINS
5 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
497.5
306.3
278.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
275.5
228.4
188.6
°C/W
RθJB
Junction-to-board thermal resistance
372.2
166.5
113.2
°C/W
ΨJT
Junction-to-top characterization parameter
55.5
138.5
82.3
°C/W
ΨJB
Junction-to-board characterization parameter
370.3
165.3
112.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
165.1
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.7 Thermal Information (Dual)
THERMAL METRIC(1)
TLV7012/TLV7022
UNIT
DGK (VSSOP)
DDF (SOT-23)
DSG (WSON)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
211.7
212.5
106.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
96.1
127.3
127.3
°C/W
RθJB
Junction-to-board thermal resistance
133.5
129.2
72.5
°C/W
ΨJT
Junction-to-top characterization parameter
28.3
25.8
16.8
°C/W
ΨJB
Junction-to-board characterization parameter
131.7
129.0
72.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
47.6
°C/W



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