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TLV7021 Datasheet(PDF) 6 Page - Texas Instruments |
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TLV7021 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 52 page ![]() 6 TLV7011, TLV7021, TLV7012, TLV7022 SLVSDM5F – SEPTEMBER 2017 – REVISED MARCH 2020 www.ti.com Product Folder Links: TLV7011 TLV7021 TLV7012 TLV7022 Submit Documentation Feedback Copyright © 2017–2020, Texas Instruments Incorporated 6.5 Recommended Operating Conditions (Dual) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage VS = VCC – VEE 1.6 6.5 V Input voltage range VCC – 0.1 VEE + 0.2 V Ambient temperature, TA –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.6 Thermal Information (Single) THERMAL METRIC(1) TLV7011/TLV7021 UNIT DPW (X2SON) DBV (SOT23) DCK (SC70) 5 PINS 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 497.5 306.3 278.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 275.5 228.4 188.6 °C/W RθJB Junction-to-board thermal resistance 372.2 166.5 113.2 °C/W ΨJT Junction-to-top characterization parameter 55.5 138.5 82.3 °C/W ΨJB Junction-to-board characterization parameter 370.3 165.3 112.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 165.1 N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.7 Thermal Information (Dual) THERMAL METRIC(1) TLV7012/TLV7022 UNIT DGK (VSSOP) DDF (SOT-23) DSG (WSON) 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 211.7 212.5 106.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 96.1 127.3 127.3 °C/W RθJB Junction-to-board thermal resistance 133.5 129.2 72.5 °C/W ΨJT Junction-to-top characterization parameter 28.3 25.8 16.8 °C/W ΨJB Junction-to-board characterization parameter 131.7 129.0 72.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 47.6 °C/W |
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