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TLV809 Datasheet(PDF) 5 Page - Texas Instruments

Part # TLV809
Description  TLV8x3 3-Pin Voltage Supervisors with Active-Low, Open-Drain Reset
PDF  25 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TLV809 Datasheet(HTML) 5 Page - Texas Instruments

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7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating junction temperature range (unless otherwise noted)
MIN
MAX
UNIT
Voltage
VDD(2)
0
6.5
V
All other pins(2)
–0.3
+6.5
Current
Maximum low output current, IOL
5
mA
Maximum high output current, IOH
–5
Input clamp current, IIK (VI < 0 or VI > VDD)
±20
Output clamp current, IOK (VO < 0 or VO > VDD)
±20
Temperature
Operating junction temperature range, TJ
–40
125
°C
Storage temperature range, Tstg
–65
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to GND. For reliable operation the device should not be operated at 6.5 V for more than t = 1000h
continuously
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Thermal Information
THERMAL METRIC(1)
TLV8x3
UNITS
DBZ (SOT-23)
3 PINS
RθJA
Junction-to-ambient thermal resistance
328.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
135.4
°C/W
RθJB
Junction-to-board thermal resistance
58.3
°C/W
ψJT
Junction-to-top characterization parameter
5.2
°C/W
ψJB
Junction-to-board characterization parameter
59.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.4 Recommended Operating Conditions
at specified temperature range (unless otherwise noted)
MIN
MAX
UNIT
VDD
Supply voltage
1.1
6
V
TJ
Operating junction temperature
–40
125
°C
www.ti.com
TLV803, TLV853, TLV863
SBVS157E – APRIL 2011 – REVISED DECEMBER 2020
Copyright © 2020 Texas Instruments Incorporated
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5
Product Folder Links: TLV803 TLV853 TLV863



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