Table 8-2. Minimum Required CLoad to Avoid Glitch Overshoot Over Power Supply Start-up Step

Response (without CBy-pass)

Load

Capacitance

+VS = 3.3V

+VS = 5V

+VS = 36V

tr = 0.1μs

tr = 1μs

tr = 0.1μs

tr = 1μs

tr = 0.1μs

tr = 1μs

CLoad (min)

at TA = -40°C

0.33nF

0.33nF

0.47nF

0.47nF

10nF

10nF

CLoad (min)

at TA = 25°C

0.02nF

NA

0.05nF

0.05nF

0.68nF

0.68nF

CLoad (min)

at TA = 150°C

NA

NA

NA

NA

0.12nF

0.12nF

Figure 8-6 and Figure 8-7 show start-up step response to 3.3V and 36V power supply with around 3.3V/μs

ramp rate (without using CBy-pass). Each figure shows the output response to no load and minimum required

CLoad when glitch overshoot is eliminated. The worst-case scenario (as shown in Table 8-2) is happened when

operating temperature is -40°C.

Time (

s)

-20

20

60

100

140

180

220

-1

-0.2

0

0

1

0.2

2

0.4

3

0.6

4

0.8

5

1

 +VS

VO →

+VS = 3.3V

VO (at -40C) and No CLoad

VO (at -40C) and CLoad = 0.33nF

Figure 8-6. Start-up Response to +VS = 3.3V Step

Without CBy-pass When SR = 3.3V/μs (With No CLoad

and CLoad = 0.33nF)

Time (

s)

-20

0

20

40

60

80 100 120 140 160 180 200 220

-8

-0.2

0

0

8

0.2

16

0.4

24

0.6

32

0.8

40

1

48

1.2

56

1.4

VO →

 +VS

+VS = 36V

VO (at -40C) and No CLoad

VO (at -40C) and CLoad = 10nF

Figure 8-7. Start-up Response to +VS = 36V Step

Without CBy-pass When SR = 3.3V/μs (With No CLoad

and CLoad = 10nF)

Note

TI suggests adding a minimum 0.1µF CBy-pass (between +VS and GND) and/or a 0.1µF CLoad (between

VO and GND) capacitors to avoid supply noise and glitch overshoot.

8.2.1.2.2 LM50HV Self-heating

The LM50HV temperature accuracy error (due to self-heating) versus power supply is shown in Figure 8-8.

The device is soldered to 30-gauge wire in this measurement and the temperature is read after consistently

10 minutes working of the device at 25°C. Since temperature error is directly proportional to thermal resistance

(Rth) and power (+VS × IDD), the temperature error is increased by changing power supply from 3V to 36V. By

considering junction-to-ambient thermal resistance value in Section 6.4 and supply current vs supply voltage

in Figure 6-26, temperature error around ±0.15°C should be expected (for up to 36V power supply) between

calculated value (ΔTERR (°C) = Rth × (+VS) × IDD) and measured value shown in Figure 8-8. This possible

deviation is due to hard controlling of air temperature and humidity, position of the device on the test setup

and other factors which are addressed in Analyzing PCB Thermal Resistance in High-Accuracy Temperature

Sensors application note.

LM50, LM50HV

SNIS118I – JULY 1999 – REVISED OCTOBER 2025

www.ti.com

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