9 Device and Documentation Support

9.1 Documentation Support

Related Documentation

For related documentation see the following:

• Texas Instruments, TMP23x Low-Power, High-Accuracy Analog Output Temperature Sensors, data sheet

• Texas Instruments, ISOTMP35 ±1.2°C, 3-kVRMS Isolated Temperature Sensor With Analog Output With < 2

Seconds Response Time and 500VRMS Working Voltage, data sheet

• Texas Instruments, LM60 2.7V, SOT-23 or TO-92 Temperature Sensor, data sheet

• Texas Instruments, Tiny Temperature Sensors for Remote Systems, application note

• Texas Instruments, Semiconductor Temperature Sensors Challenge Precision RTDs and Thermistors in

Building Automation, application note

• Texas Instruments, LM50HV Evaluation Module, EVM

• Texas Instruments, LMT90 Temperature Sensor Evaluation Module, EVM

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

HUMISEAL® is a registered trademark of Columbia Chase Corporation.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (May 2025) to Revision I (October 2025)

Page

• Added the LM50HV device throughout the document; updated the data sheet title.......................................... 1

Changes from Revision G (January 2017) to Revision H (May 2025)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Moved the automotive device to a standalone data sheet (SNIS249)................................................................1

LM50, LM50HV

SNIS118I – JULY 1999 – REVISED OCTOBER 2025

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