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LM35 Datasheet(PDF) 23 Page - Texas Instruments |
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LM35 Datasheet(HTML) 23 Page - Texas Instruments |
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23 / 33 page ![]() 8.5.3 Thermal Considerations Table 8-3 summarizes the thermal resistance of the LM50 (Legacy chip) only for different conditions. Table 8-3. Temperature Rise of LM50 (Legacy chip) only Due to Self-Heating RθJA (°C/W) SOT-23 No heat sink(1) Still air (Legacy chip) 291.9 Moving air (Legacy chip) - Small heat fin(2) Still air (Legacy chip) 260 Moving air (Legacy chip) 180 (1) Part soldered to 30 gauge wire. (2) Heat sink used is 0.5inch, square printed-circuit board with 2oz foil; part attached as shown in Figure 8-14. www.ti.com LM50, LM50HV SNIS118I – JULY 1999 – REVISED OCTOBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: LM50 LM50HV |
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