www.ti.com

PACKAGE OUTLINE

C

6X

0.35

0.25

1.6 0.1

6X

0.3

0.2

2X

1.3

1 0.1

4X 0.65

0.8

0.7

0.05

0.00

B

2.1

1.9

A

2.1

1.9

(0.2) TYP

WSON - 0.8 mm max height

DRV0006D

PLASTIC SMALL OUTLINE - NO LEAD

4225563/A 12/2019

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

3

4

6

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

7

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 5.500