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PACKAGE OUTLINE

C

8.3

7.9

TYP

30X 0.65

32X

0.30

0.19

2X

9.75

(0.15) TYP

0 - 8

0.15

0.05

1.2 MAX

2.50

1.77

4.19

3.61

0.25

GAGE PLANE

0.75

0.50

A

11.1

10.9

NOTE 3

B

6.2

6.0

2X (0.9)

NOTE 5

2X (0.15)

NOTE 5

PowerPAD

TSSOP - 1.2 mm max height

DAP0032D

PLASTIC SMALL OUTLINE

4231420/A 07/2025

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MO-153.

5. Features may differ and may not be present.

PowerPAD is a trademark of Texas Instruments.

TM

1

32

0.1

C A B

17

16

PIN 1 ID AREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 1.500

EXPOSED

THERMAL PAD