5

TUSB1064

www.ti.com

SLLSF48C – MARCH 2018 – REVISED SEPTEMBER 2019

Product Folder Links: TUSB1064

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Copyright © 2018–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature and voltage range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply Voltage Range

-0.3

4

V

VIN_DIFF

Differential Voltage at Differential Inputs

±2.5

V

VIN_SE

Input Voltage at Differential Inputs

-0.5

4

V

VIN_CMOS

Input Voltage at CMOS Inputs

-0.3

4

V

TJ

TUSB1064 Junction Temperature

110

°C

TUSB1064I Junction Temperature

125

°C

TSTG

Storage temperature

-65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001, all pins(1)

±5000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature and voltage range (unless otherwise noted)

MIN

NOM

MAX

UNIT

TA

Ambient temperature for TUSB1064

0

70

°C

TA

Ambient temperature for TUSB1064I

-40

85

°C

VCC

Supply voltage

3

3.3

3.6

V

VCC_RAMP

Power supply ramp

0.1

100

ms

VI2C

Supply that external resistors on SDA and SCL are pulled up to

1.7

3.6

V

VPSN

Power supply noise on VCC

100

mV

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TUSB1064

UNIT

RNQ (WQFN)

40 PINS

RθJA

Junction-to-ambient thermal resistance

37.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

20.7

°C/W

RθJB

Junction-to-board thermal resistance

9.5

°C/W

ΨJT

Junction-to-top characterization parameter

0.2

°C/W

ΨJB

Junction-to-board characterization parameter

9.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.3

°C/W