5.3 Recommended Operating Conditions

See (1) (2).

VCCA

VCCB

MIN

MAX UNIT

VCCA

Supply voltage

1.2

3.6

V

VCCB

1.65

5.5

VIH

High-level input voltage

Data inputs

1.2V to 3.6V

1.65V to 5.5V

VCCI × 0.65(3)

VCCI

V

OE

1.2V to 3.6V

1.65V to 5.5V

VCCA × 0.65

5.5

VIL

Low-level input voltage

Data inputs

1.2V to 5.5V

1.65V to 5.5V

0

VCCI × 0.35(3)

V

OE

1.2V to 3.6V

1.65V to 5.5V

0

VCCA × 0.35

Δt/Δv

Input transition

rise or fall rate

A-port inputs

1.2V to 3.6V

1.65V to 5.5V

40

ns/V

B-port inputs

1.2V to 3.6V

1.65V to 3.6V

40

4.5V to 5.5V

30

TA

Operating free-air temperature

–40

85

°C

(1)

The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.

(2)

VCCA must be less than or equal to VCCB and must not exceed 3.6V.

(3)

VCCI is the supply voltage associated with the input port.

5.4 Thermal Information

THERMAL METRIC(1)

TXB0101

UNIT

DBV

(SOT-23)

DCK

(SC70)

DRL

(SOT)

YZP

(DSBGA)

DRY

(USON)

6 PINS

6 PINS

6 PINS

6 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

192.3

266.9

204.2

105.8

277.6

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

164.8

80.4

76.4

1.6

163.1

°C/W

RθJB

Junction-to-board thermal resistance

38.6

99.1

38.7

10.8

158.9

°C/W

ψJT

Junction-to-top characterization parameter

43.7

1.5

3.4

3.1

29.3

°C/W

ψJB

Junction-to-board characterization parameter

38.1

98.3

38.5

10.8

158.2

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

TXB0101

SCES639F – JANUARY 2007 – REVISED SEPTEMBER 2025

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