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DM505LRBABF Datasheet(PDF) 292 Page - Texas Instruments |
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DM505LRBABF Datasheet(HTML) 292 Page - Texas Instruments |
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292 / 295 page ![]() www.ti.com PACKAGE OUTLINE C 2.82 MAX 0.4 0.2 TYP 13.65 TYP 13.65 TYP 0.65 TYP 0.65 TYP 367X 0.45 0.35 (2.39) A 15.12 14.88 B 15.12 14.88 (0.68) TYP (0.99) (1.3) (0.68) TYP ( 14.6) ( 11.6) FCBGA - 2.82 mm max height ABF0367A BALL GRID ARRAY 4221430/C 04/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C. 4. Primary datum C and seating plane are defined by the spherical crown of the solder balls. BALL A1 CORNER SEATING PLANE BALL TYP 0.1 C NOTE 4 0.25 C A C E G J L N R U W AA 1 2 3 0.15 C A B 0.08 C NOTE 3 SYMM SYMM 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 B D F H K M P T V Y AB SCALE 0.900 |
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