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MP8771 Datasheet(PDF) 3 Page - Monolithic Power Systems |
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MP8771 Datasheet(HTML) 3 Page - Monolithic Power Systems |
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3 / 24 page ![]() MP8771 – 18V, 10A, SYNCHRONOUS, STEP-DOWN CONVERTER MP8771 Rev. 1.11 www.MonolithicPower.com 3 2/24/2020 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2020 MPS. All Rights Reserved. ABSOLUTE MAXIMUM RATINGS (1) VIN.................................................. -0.3V to +20V VSW ........................................ -0.3V (-5V < 10ns) to VIN + 0.7V (23V < 10ns) VBST........................................................VSW + 4V VEN...................................................................VIN All other pins ................................... -0.3V to +4V Continuous power dissipation (TA = +25°C) (2) ..................................................................... 3.2W Junction temperature ................................ 150°C Lead temperature...................................... 260°C Storage temperature...................-65°C to 125°C ESD Rating Human-body model (HBM).....................±2000V Charged-device model (CDM)................±2000V Recommended Operating Conditions (3) Supply voltage (VIN) ............................ 3V to 18V Output voltage (VOUT)............. 0.6V to VIN * DMAX or 12V max Operating junction temp. (TJ)....-40°C to +125°C Thermal Resistance θJA θJC QFN-16 (3mmx3mm) EV8771-Q-00A(4) .................. 38 ....... 10 .....°C/W JESD51-7 (5) ......................... 50 ....... 12 .....°C/W NOTES: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation on EV8771-Q-00A board at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on EV8771-Q-00A, 4-layer PCB. 5) The value of θJA given in this table is only valid for comparison with other packages and cannot be used for design purposes. These values were calculated in accordance with JESD51-7, and simulated on a specified JEDEC board. They do not represent the performance obtained in an actual application. |
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