AD8016ARB datasheet(15/20 Pages) AD

15 / 20 page

REV. B

AD8016

–15–

EXPERIMENTAL RESULTS

The experimental data suggests that for both packages, and a

PCB as small as 4.7 square inches, reasonable junction tempera-

tures can be maintained even in the absence of air flow. The graph

in Figure 42 shows junction temperature versus air flow for various

dimensions of 1 oz. copper PCBs at an ambient temperature of

°C in both the ARB and ARP packages. For the worst-case

package, the AD8016ARB and the worst-case PCB at 4.7 square

inches, the extrapolated junction temperature for an ambient

environment of 85

°C would be approximately 132°C with 0 LFM

of air flow. If the target maximum junction temperature of the

AD8016ARB is 125

°C, a 4-layer PCB with 1 oz. copper covering

the outer layers and measuring 9 square inches is required

with 0 LFM of air flow.

Note that the AD8016ARE is targeted at xDSL applications

other than full-rate CO ADSL. The AD8016ARE is targeted at

g.lite and other xDSL applications where reduced power dissi-

pation can be achieved through a reduction in output power.

Extreme temperatures associated with full-rate ADSL using the

AD8016ARE should be avoided whenever possible.

AIR FLOW (LFM)

100

150

200

ARP 6 SQ-IN

ARP 4.7 SQ-IN

ARP 12 SQ-IN

ARB 4.7 SQ-IN

ARB 7.125 SQ-IN

ARB 9 SQ-IN

ARB 6 SQ-IN

ARP 9 SQ-IN

+24 C AMBIENT

Figure 42. Junction Temperature vs. Air Flow

PCB AREA (SQ-IN)

710

ARB 0 LFM

ARB 50 LFM

ARB 100 LFM

ARB 200 LFM

ARB 150 LFM

ARP 0 LFM

ARP 100 LFM

ARP 200 LFM

ARP 150 LFM

ARP 50 LFM

Figure 43. Junction-to-Ambient Thermal Resistance vs.

PCB Area

135

PCB AREA (SQ-IN)

ARE 0 LFM

ARE 200 LFM

ARE 400 LFM

Figure 44. Junction-to-Ambient Thermal Resistance vs.

PCB Area

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