REV. B

AD8016

–20–

OUTLINE DIMENSIONS

Revision History

Location

Page

11/03—Data Sheet changed from REV. A to REV. B.

Changes to ORDERING GUIDE ....................................................................................................................................................4

Changes to TPC 21 .........................................................................................................................................................................8

Updated OUTLINE DIMENSIONS........................................................................................................................................19-20

28-Lead Thin Shrink Small Outline With Exposed Pad [TSSOP-EP]

(RE-28-1)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-153AET

1.05

1.00

0.80

SEATING

PLANE

1.20

MAX

0.15

0.00

0.30

0.19

4.50

4.40

4.30

28

15

14

1

9.80

9.70

9.60

PIN 1

6.40

BSC

0.65

BSC

0.20

0.09

8

0

0.75

0.60

0.45

EXPOSED

PAD

(Pins Down)

3.00

BSC

3.50

BSC

BOTTOM

VIEW

20-Lead Power SOIC, Thermally Enhanced Package [PSOP3]

(RP-20A)

Dimensions shown in millimeters

BOTTOM VIEW

6.20

5.80

13.00

9.00

8

0

2.90 MAX

2 PLACES

END VIEW

VIEW A

VIEW A

1.10

0.80

SEATING

PLANE

1.27

BSC

0.53

0.40

14.20

BSC

11.00

BSC

1

10

20

11

15.90

BSC

TOP VIEW

1.10 MAX

45

1.10 MAX

2 PLACES

PIN 1

SIDE VIEW

3.60

3.35

3.10

1.00

0.90

0.80

3.60

3.35

3.10

3.30

3.15

3.00

0.30

0.20

0.10

0.10

0.05

0.00

0.32

0.23

COMPLIANT TO JEDEC STANDARDS MO-166AA