INTEGRATED CIRCUITS DIVISION

PLA110L

www.ixysic.com

5

R09

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of

the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of

our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices

when handled according to the limitations and information in that standard as well as to any limitations set forth in the

information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product

performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device

Moisture Sensitivity Level (MSL) Classification

PLA110LS

MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (T

C) and the maximum total dwell

time (t

P) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.

The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering

processes.

Device

Classification Temperature (T

c)

Dwell Time (t

P)

Max Reflow Cycles

PLA110LS

250ºC

30 seconds

3

For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is

provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder

wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the

last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.

Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering

process.

Device

Maximum Pin Temperature

Maximum Body Temperature

Maximum Dwell Time

Wave Cycles

PLA110L

260ºC

250ºC

10 seconds*

1

*Total cumulative duration of all waves.

Board Wash

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux

residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to

the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake

cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability

of the wash parameters used to clean the board, determination of the bake temperature and duration necessary

to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying

methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must

not be exposed to halide flux or solvents.