HV861

DS20005911B-page 12

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2023-2026 Microchip Technology Inc. and its subsidiaries

Microchip Technology Drawing C04-303A Sheet 2 of 2

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

3.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

16-Lead Very, Very Thin Plastic Quad Flat, No Lead Package (3P) - 3x3 mm Body

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

[WQFN]; Supertex Legacy Package K7

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.50 BSC

0.20 REF

0.20

0.18

0.70

0.00

0.25

0.30

0.75

0.02

3.00 BSC

MILLIMETERS

MIN

NOM

16

0.45

0.30

0.80

0.05

MAX

K-

0.20

-

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

D

D2

1.50

3.00 BSC

1.65

1.80

1.50

1.65

1.80

-

0.20

-

Mold Angle

0°

7°

14°

L

L1

DETAIL A

Pullback

L1

--

0.15

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