TMP442 datasheet(5/60 Pages) TI2

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6 Specifications

6.1 Absolute Maximum Ratings

Over free-air temperature range unless otherwise noted(1)

MIN

MAX

UNIT

Supply voltage

VDD

–0.3

I/O voltage

DP1, DP2

–0.3

1.65

DN1, DN2

–0.3

0.3

ALERT, T_CRIT, SCL, SDA

–0.3

I/O current

ALERT, T_CRIT, SDA

–10

Operating junction temperature, TJ

–55

150

°C

Storage temperature, Tstg

–65

150

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

HBM ESD Classification Level 2

±2000

Charged device model (CDM), per AEC Q100-011

CDM ESD Classification Level C4B

±750

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VDD

Supply voltage

1.62

3.3

5.5

VI/O

DP1, DP2

1.2

DN1, DN2

ALERT, T_CRIT, SCL, SDA

5.5

II/O

ALERT, T_CRIT, SDA

Operating ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMP4719-Q1

UNIT

DGS (VSSOP)

10 PINS

RθJA

Junction-to-ambient thermal resistance

155.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

62.9

°C/W

RθJB

Junction-to-board thermal resistance

91.7

°C/W

ψJT

Junction-to-top characterization parameter

5.6

°C/W

ψJB

Junction-to-board characterization parameter

90.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

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TMP4719-Q1

SLVSJS0 – DECEMBER 2025

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