Datasheet

NJMOP277/NJMOP2277

* NJMOP2277FE and NJMOP2277FR are discontinued products.

- 4 -

Ver.3.0

■ ABSOLUTE MAXIMUM RATINGS

Symbol

Rating

Unit

Supply Voltage VS = V+ - V−

V+ - V−

40

V

Differential Input Voltage*1

VID

±40*2

V

Input Voltage*3

VIN

V--0.3 to V++0.3

V

Input Current*4

IIN

10

mA

Output Short-Circuit Duration*5

-

Continuous (Ta

≤ 25°C)

Storage Temperature

Tstg

-55 to 150

°C

Junction Temperature *6

Tj

150

°C

*1

Differential voltage is the voltage difference between +INPUT and −INPUT.

*2 For supply voltage less than 40V, the absolute maximum rating is equal to the supply voltage.

*3 The absolute maximum input voltage is limited at 40V.

*4 Input voltages outside the supply voltage will be clamped by ESD protection diodes. If the input voltage exceeds the supply voltage, the input

current must be limited 10 mA or less by using a restriction resistance.

*5 Continuous short-circuits from output to GND is guaranteed only when V+

≤ 11V (±5.5V) and into 1ch.

*6 Calculate the power consumption of the IC from the operating conditions, and calculate the junction temperature with the thermal resistance.

Please refer to "Thermal characteristics" for the thermal resistance under our measurement board conditions.

ABSOLUTE MAXIMUM RATINGS

Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the

lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum

ratings is not assured.

■ THERMAL CHARACTERISTICS

Package

Measurement Result

Unit

Thermal Resistance (θja)

Thermal Characterization Parameter (ψjt)

NJMOP277

SOP8 JEDEC 150mil (EMP8) *1

MSOP8 (VSP8) *1

122

189

27

53

°C/W

NJMOP2277

SOP8 JEDEC 150mil (EMP8) *1

MSOP8 (VSP8) *1

DFN8-W2 (ESON8-W2) *2

104

152

58

13

24

7

°C/W

θja:Junction-to-Ambient Thermal Resistance

ψjt:Junction-to-Top Thermal Characterization Parameter

*1 Mounted on glass epoxy board (76.2 mm × 114.3 mm × 1.6 mm: based on EIA/JEDEC standard, 4-layer FR-4), internal Cu area: 74.2 mm × 74.2 mm.

*2 Mounted on glass epoxy board (101.5 mm × 114.5 mm × 1.6 mm: based on EIA/JEDEC standard, 4-layer FR-4) with exposed pad.

(For 4-layer, applying 99.5 mm × 99.5 mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5.)