Table 4-2. LM50-Q1 and LM50HV-Q1 Devices Orderable Options

DEVICE NAME

PART NUMBER

ACCURACY OVER

TEMPERATURE

SPECIFIED

TEMPERATURE RANGE

SUPPLY RANGE

PACKAGE

LM50-Q1

LM50QIM3X/NOPB

±4°C

–40°C ≤ TA ≤ +125°C

(Both legacy & new chip)

4.5V to 10V

SOT-23

(DBZ)

3-pin

LM50HV-Q1

LM50HVQDBZRQ1

±2°C

20°C ≤ TA ≤ +70°C

3V to 36V

±2.5°C

0°C ≤ TA ≤ +100°C

±3°C

–20°C ≤ TA ≤ +125°C

±3.5°C

–40°C ≤ TA ≤ +125°C

LM50HVEDBZRQ1

±2°C

20°C ≤ TA ≤ +70°C

±2.5°C

0°C ≤ TA ≤ +100°C

±3°C

–20°C ≤ TA ≤ +125°C

±3.5°C

–40°C ≤ TA ≤ +150°C

Table 4-3. LM50-Q1 and LM50HV-Q1 Devices Nomenclature Detail

PRODUCT

DESCRIPTION

LM50xIyyy

x indicates that the device has Q (grade-1 device in accordance with the AEC-Q100 standard) variant. This

device can ship with the legacy chip (CSO: GF6 or SHE) or the new chip (CSO: RFB) with different chip source

origin (CSO). The reel packaging label provides date code information to distinguish which chip is being used.

Device performance for new and legacy chips is denoted throughout the document.

yyy indicates the package type of the device which is M3X/NOPB in DBZ (SOT-23 3-pin).

LM50HVx yyyRQ1

x indicates that the device has Q (grade-1) or E (grade-0) variant in accordance with the AEC-Q100 standard.

LM50HV-Q1 has only CSO: RFB.

yyy indicates that the package type of the device is DBZ (SOT-23 3-pin).

5 Pin Configuration and Functions

1

+V

S

V

O

GND

2

3

Figure 5-1. DBZ Package 3-Pin SOT-23 Top View

Table 5-1. Pin Functions

PIN

TYPE

DESCRIPTION

NO.

NAME

1

+VS

Power

Positive power supply pin.

2

VO

Output

Temperature sensor analog output.

3

GND

Ground

Device ground pin, connected to power supply negative terminal.

LM50-Q1, LM50HV-Q1

SNIS249A – MAY 2025 – REVISED FEBRUARY 2026

www.ti.com

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