6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range unless otherwise noted(1)

MIN

MAX

UNIT

Supply voltage, +VS

LM50-Q1

-0.2

12

V

LM50HV-Q1

-0.2

39.6

Output voltage, VO

LM50-Q1

-1 +VS + 0.6(2)

V

LM50HV-Q1

-0.3 +VS + 0.3(2)

Output current, IOUT

10

mA

Maximum junction temperature, TJ

150

°C

Storage temperature, Tstg

LM50-Q1

-65

150

°C

LM50HV-Q1

-65

175

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Maximum voltage must not exceed 12V for LM50-Q1 and 39.6V for LM50HV-Q1.

6.2 ESD Ratings

VALUE

UNIT

V(ESD),

Electrostatic

discharge

LM50-Q1

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

LM50HV-Q1

±2500

LM50-Q1

Charged-device model (CDM), per AEC Q100-011

±750

V

LM50HV-Q1

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

+VS

Supply voltage

LM50-Q1

4.5

10

V

LM50HV-Q1

3

36

TMIN,TMAX

Specified temperature

LM50-Q1

-40

125

°C

LM50HV-Q1

-40

150

6.4 Thermal Information

THERMAL METRIC(1)

LM50-Q1

LM50HV-Q1

UNIT

DBZ (SOT-23) Legacy chip

DBZ (SOT-23) New chip

DBZ (SOT-23)

3 PINS

3 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

291.9

240.6

240.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

114.3

144.5

144.5

°C/W

RθJB

Junction-to-board thermal resistance

62.3

72.3

72.3

°C/W

ψJT

Junction-to-top characterization parameter

7.4

28.7

28.7

°C/W

ψJB

Junction-to-board characterization parameter

61

71.7

71.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

www.ti.com

LM50-Q1, LM50HV-Q1

SNIS249A – MAY 2025 – REVISED FEBRUARY 2026

Copyright © 2026 Texas Instruments Incorporated

Submit Document Feedback

5

Product Folder Links: LM50-Q1 LM50HV-Q1