8.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision R (May 2025) to Revision S (April 2026)

Page

• Added silicon 5V output ground current specification.........................................................................................5

Changes from Revision Q (September 2024) to Revision R (May 2025)

Page

• Added new silicon DBV thermals....................................................................................................................... 4

• Updated DRB (VSON) for DRB0008A package outline..................................................................................... 4

• Changed legacy chip to legacy silicon in Device Nomenclature table..............................................................27

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

TPS732

SBVS037S – AUGUST 2003 – REVISED APRIL 2026

www.ti.com

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