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Mechanical Data

7.1 Thermal Data for ZUT

7.1.1 Packaging Information

TMS320DM647/TMS320DM648

Digital Media Processor

www.ti.com

SPRS372B – MAY 2007 – REVISED APRIL 2008

The following table(s) show the thermal resistance characteristics for the ZUT mechanical package.

See Power Application Report.

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

ΘJC Junction-to-case

1.7

N/A

ΘJB

ΘJB Junction-to-board

8.6

N/A

ΘJA

ΘJA Junction-to-free air

17.2

0.0

13.7

1.0

12.4

2.0

11.5

3.0

ψJT Junction-to-package top

0.6

0.0

0.6

1.0

0.6

2.0

0.7

3.0

ψi

ψJB Junction-to-board

8.4

0.0

7.4

1.0

7.0

2.0

6.7

3.0

(1)

The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC

defined 1S2P system and will change based on environment as well as application.

For more information, see these three EIA/JEDEC standards:

•

EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2)

m/s = meters per second

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

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