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LTC4002 Datasheet(PDF) 15 Page - Linear Technology |
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LTC4002 Datasheet(HTML) 15 Page - Linear Technology |
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15 / 24 page ![]() 15 LTC3783 3783f Boost Converter: Inductor Selection Given an operating input voltage range, and having chosen the operating frequency and ripple current in the inductor, the inductor value can be determined using the following equation: L V If D where I I IN MIN L MAX L OUT = ∆ ⎛ ⎝⎜ ⎞ ⎠⎟ ∆ = () ( • • : • χ M MAX MAX D ) – 1 Remember that most boost converters are not short- circuit protected. Under a shorted output condition, the inductor current is limited only by the input supply capa- bility. For applications requiring a step-up converter that is short-circuit protected, please refer to the applications section covering SEPIC converters. The minimum required saturation current of the inductor can be expressed as a function of the duty cycle and the load current, as follows: I I D L SAT OUT MAX MAX () () • – >+ ⎛ ⎝⎜ ⎞ ⎠⎟ 1 21 χ The saturation current rating for the inductor should be checked at the minimum input voltage (which results in the highest inductor current) and maximum output current. Boost Converter: Operating in Discontinuous Mode Discontinuous mode operation occurs when the load current is low enough to allow the inductor current to run out during the off-time of the switch, as shown in Figure 7. Once the inductor current is near zero, the switch and diode capacitances resonate with the inductance to form damped ringing at 1MHz to 10MHz. If the off-time is long enough, the drain voltage will settle to the input voltage. Depending on the input voltage and the residual energy in the inductor, this ringing can cause the drain of the power MOSFET to go below ground where it is clamped by the body diode. This ringing is not harmful to the IC and it has not been shown to contribute significantly to EMI. Any attempt to damp it with a snubber will degrade the efficiency. Boost Converter: Power MOSFET Selection The power MOSFET can serve two purposes in the LTC3783: it represents the main switching element in the power path, and its RDS(ON) can represent the current sensing element for the control loop. Important parameters for the power MOSFET include the drain-to-source breakdown voltage BVDSS, the threshold voltage VGS(TH), the on- resistance RDS(ON) versus gate-to-source voltage, the gate-to-source and gate-to-drain charges QGS and QGD, respectively, the maximum drain current ID(MAX) and the MOSFET’s thermal resistances θJC and θJA. The gate drive voltage is set by the 7V INTVCC low drop regulator. Consequently, 6V rated MOSFETs are required in most high voltage LTC3783 applications. If low input voltage operation is expected (e.g., supplying power from a lithium-ion battery or a 3.3V logic supply), then sublogic- level threshold MOSFETs should be used. Pay close atten- tion to the BVDSS specifications for the MOSFETs relative to the maximum actual switch voltage in the application. Many logic-level devices are limited to 30V or less, and the switch node can ring during the turn-off of the MOSFET due to layout parasitics. Check the switching waveforms of the MOSFET directly across the drain and source terminals using the actual PC board layout for excessive ringing. OPERATIO OUTPUT VOLTAGE 200mV/DIV INDUCTOR CURRENT 1A/DIV 1 µs/DIV 3783 F07 MOSFET DRAIN VOLTAGE 20V/DIV Figure 7. Discontinuous Mode Waveforms |
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