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©2020 Renesas Electronics Corporation

December 9, 2022

9DBL02x3/9DBL04x3/ 9DBL06x3/9DBL08x3 Datasheet

Package Outline Drawings

The package outline drawings are located at the end of this document and are accessible from the Renesas website. The package

information is the most current data available and is subject to change without revision of this document.

Thermal Characteristics

Table 37. Thermal Characteristics [a]

[a] epad soldered to ground

Symbol

Conditions

Package

Typical Values

Units

θJC

Junction to case.

NDG48

33

°C/W

θJb

Junction to base.

2

°C/W

θJA0

Junction to air, still air.

37

°C/W

θJA1

Junction to air, 1 m/s air flow.

30

°C/W

θJA3

Junction to air, 3 m/s air flow.

27

°C/W

θJA5

Junction to air, 5 m/s air flow.

26

°C/W

θJC

Junction to case.

NDG40

NLG32

42

°C/W

θJb

Junction to base.

2

°C/W

θJA0

Junction to air, still air.

39

°C/W

θJA1

Junction to air, 1 m/s air flow.

33

°C/W

θJA3

Junction to air, 3 m/s air flow.

28

°C/W

θJA5

Junction to air, 5 m/s air flow.

27

°C/W

θJC

Junction to case.

NLG24

60

°C/W

θJb

Junction to base.

5.4

°C/W

θJA0

Junction to air, still air.

50

°C/W

θJA1

Junction to air, 1 m/s air flow.

43

°C/W

θJA3

Junction to air, 3 m/s air flow.

39

°C/W

θJA5

Junction to air, 5 m/s air flow.

38

°C/W