TDA7267A datasheet(3/7 Pages) STMICROELECTRONICS

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APPLICATION HINTS:

For 14.5V supply and 8

Ω speaker application, its

maximum power dissipation is about 1.8W.

Assumming that max ambient temperature is

°C, the required thermal resistance of the de-

vice mounted on the PCB with a dissipating area

must be equal to: (150 - 70)/1.8 = 44.4

°C/W.

Junction to pin thermal resistance of the package

is about 15

°C/W. That means external heat sink

of about 30

°C/W is required.

Cu ground plane of PCB can be used as heat dis-

sipating means.

SVR

P-GND

100

µF

VS=14.5V

C5 470

µF

OUT

Ω

C1 0.1

µF

D98AU828

STAND-BY

9 to 16

S-GND

Figure 1. Application Circuit

THERMAL DATA

Symbol

Parameter

Value

Unit

Rth j-amb

Thermal Resistance Junction to ambient

°C/W

Rth j-case

Thermal Resistance Junction to case

°C/W

ELECTRICAL CHARACTERISTICS (Tamb = 25

°C; VS = 14.5V; RL = 8Ω; f = 1KHz; unless otherwise

specified.)

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

Supply Voltage Range

Quiescent Current

Isb

Stand-By Current

Pin 3 shorted to GND

0.3

Quiescent Output Voltage

7.5

Voltage Gain

RIN

Input Impedance

100

Ω

Output Power

THD = 10%

2.7

THD

Distortion

PO = 1W

0.1

0.3

SVR

Supply Voltage Rejection

Vripple = 150mVrms;

Fripple = 1KHz

Input Noise Voltage

Rg = 10K

Ω; BW = 20Hz to 20KHz

µV

Vsb

Stand-By Enable Voltage

TDA7267A

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