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TDF8553J Datasheet(PDF) 47 Page - NXP Semiconductors

Part # TDF8553J
Description  I2C-bus controlled 4 X 50 Watt power amplifier and multiple voltage regulator
PDF  47 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

TDF8553J Datasheet(HTML) 47 Page - NXP Semiconductors

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NXP Semiconductors
TDF8553J
4
× 50 Watt power amplifier and multiple voltage regulator
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 December 2008
Document identifier: TDF8553J_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
19. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
1.1
Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2
Voltage regulators. . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
7.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
7.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
8
Functional description . . . . . . . . . . . . . . . . . . . 8
8.1
Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.2
Start-up and shut-down timing . . . . . . . . . . . . . 8
8.3
Power-on reset and supply voltage spikes . . . . 8
8.4
Diagnostic output . . . . . . . . . . . . . . . . . . . . . . . 8
8.5
Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8.5.1
Muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8.5.2
Temperature protection. . . . . . . . . . . . . . . . . . . 9
8.5.3
Offset detection. . . . . . . . . . . . . . . . . . . . . . . . . 9
8.5.4
Speaker protection . . . . . . . . . . . . . . . . . . . . . . 9
8.5.5
Line driver mode . . . . . . . . . . . . . . . . . . . . . . . . 9
8.5.6
Input and AC ground capacitor values . . . . . . 10
8.5.7
Load detection . . . . . . . . . . . . . . . . . . . . . . . . 10
8.5.7.1
DC-load detection . . . . . . . . . . . . . . . . . . . . . . 10
8.5.7.2
AC-load detection . . . . . . . . . . . . . . . . . . . . . . 10
8.5.7.3
Load detection procedure . . . . . . . . . . . . . . . . 11
8.5.8
Low headroom protection . . . . . . . . . . . . . . . . 11
8.6
Voltage regulators. . . . . . . . . . . . . . . . . . . . . . 12
8.6.1
Standby regulator outputs. . . . . . . . . . . . . . . . 12
8.6.2
Backup capacitor . . . . . . . . . . . . . . . . . . . . . . 12
8.6.3
Backup function . . . . . . . . . . . . . . . . . . . . . . . 13
8.6.4
Power switches . . . . . . . . . . . . . . . . . . . . . . . . 13
8.6.5
External DC-to-DC converter . . . . . . . . . . . . . 14
8.6.6
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8.6.7
Temperature protection. . . . . . . . . . . . . . . . . . 14
8.7
I2C-bus specification . . . . . . . . . . . . . . . . . . . . 14
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 21
10
Thermal characteristics. . . . . . . . . . . . . . . . . . 22
10.1
Quality specification . . . . . . . . . . . . . . . . . . . . 22
11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 23
12
Application information. . . . . . . . . . . . . . . . . . 38
12.1
Supply decoupling . . . . . . . . . . . . . . . . . . . . . 39
12.2
Beep input circuit . . . . . . . . . . . . . . . . . . . . . . 41
12.3
Noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
12.4
Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
12.4.1
Example regulator 2 . . . . . . . . . . . . . . . . . . . . 42
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 43
14
Soldering of through-hole mount packages . 44
14.1
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
14.2
Soldering by dipping or by solder wave . . . . . 44
14.3
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 44
14.4
Package related soldering information . . . . . . 44
15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 45
16
Revision history . . . . . . . . . . . . . . . . . . . . . . . 45
17
Legal information . . . . . . . . . . . . . . . . . . . . . . 46
17.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 46
17.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
17.3
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 46
17.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 46
18
Contact information . . . . . . . . . . . . . . . . . . . . 46
19
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47



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