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MH1RT Datasheet(PDF) 7 Page - ATMEL Corporation

Part # MH1RT
Description  Rad Hard 1.6M Used Gates 0.35 關m CMOS Sea of Gates/ Embedded Array
PDF  20 Pages
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Manufacturer  ATMEL [ATMEL Corporation]
Direct Link  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

MH1RT Datasheet(HTML) 7 Page - ATMEL Corporation

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4110K–AERO–11/07
MH1RT
ASIC Design
Translation
Atmel has successfully translated existing designs from most major ASIC vendors (LSI Logic®,
Motorola®, SMOS®, Oki®, NEC®, Fujitsu®, AMI® and others) into the gate arrays. These designs
have been optimized for speed and gate count and modified to add logic or memory, or repli-
cated for a pin-to-pin compatible, drop-in replacement.
Design Entry
Design entry is performed by the customer using an Atmel ASIC library. A complete netlist and
vector set must then be provided to Atmel. Upon acceptance of this data set, Atmel continues
with the standard design flow.
FPGA and PLD
Conversions
Atmel has successfully translated existing FPGA/PLD designs from most major vendors (Xil-
inx®, Actel®, Altera®, AMD® and Atmel) into the gate arrays. There are four primary reasons to
convert from an FPGA/PLD to a gate array. Conversion of high volume devices for a single or
combined design is cost effective. Performance can often be optimized for speed or low power
consumption. Several FPGA/PLDs can be combined onto a single chip to minimize cost while
reducing on-board space requirements. Finally, in situations where an FPGA/PLD was used for
fast cycle time prototyping, a gate array may provide a lower cost answer for long-term volume
production.
Cell Library
Atmel's MH1RT Series gate arrays make use of an extensive library of macro cell structures,
including logic cells, buffers and inverters, multiplexers, decoders, and I/O options. Soft macros
are also available.
The MH1RT Series PLL operates at frequencies of up to 250 MHz with minimal phase error and
jitter, making it ideal for frequency synthesis of high speed on-chip clocks and chip to chip
synchronization.
These cells are well characterized by use of SPICE modeling at the transistor level, with perfor-
mance verified on manufactured test arrays. Characterization is performed over the rated
temperature and voltage ranges to ensure that the simulation accurately predicts the perfor-
mance of the finished product.
Cells
Number of Cells
Logic Cells
95
I/O Buffers
3V or 2.5V or 3.3V
5V Tolerant
5V Compliant
110
36
70
Specific Cells
LVDS, PCI
11
SEU Hardened Cells
9
Cold Sparing
63



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