Document No. : SSC-QP-7-07-24 (Rev.00)

Rev. 00

Rev. 00

January, 2009

January, 2009

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10. soldering

10 sec. Max.

Soldering time

Condition

240℃ Max.

Peak-Temperature

120 sec. Max.

Pre-heat time

120~150℃

Pre-heat

Lead Solder

10 sec. Max.

Soldering time

Condition

260℃ Max.

Peak-Temperature

120 sec. Max.

Pre-heat time

150~200℃

Pre-heat

Lead Free Solder

260 C Max.

10 sec. Max.

o

60sec. Max.

Above 220 C

120sec. Max.

Pre-heating

150~200 C

1~5 C / sec.

o

o

o

o

1~5 C / sec.

Lead Solder

2.5~5 C / sec.

o

o

o

Pre-heating

120~150 C

120sec. Max.

60sec. Max.

Above 200 C

o

240 C Max.

10 sec. Max.

2.5~5 C / sec.

(1) Lead Solder

(2) Lead-Free Solder

Lead-frame Solder

(3) Hand Soldering conditions

Do not exceed 4 seconds at maximum 315ºC under soldering iron.

(4) The encapsulated material of the LEDs is silicone.

Precautions should be taken to avoid the strong pressure on the encapsulated

part.

So when using the chip mounter, the picking up nozzle that does not affect

the silicone resign should be used.

Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.