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EX128-CS100A Datasheet(PDF) 19 Page - Actel Corporation

Part # EX128-CS100A
Description  eX Automotive Family FPGAs
PDF  44 Pages
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Manufacturer  ACTEL [Actel Corporation]
Direct Link  http://www.actel.com
Logo ACTEL - Actel Corporation

EX128-CS100A Datasheet(HTML) 19 Page - Actel Corporation

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eX Automotive Family FPGAs
v3.2
1-15
Table 1-11
shows
the
capacitance
of
the
clock
components of eX devices.
The estimation of the dynamic power dissipation is a
piece-wise linear summation of the power dissipation of
each component.
Dynamic power dissipation
= VCCA
2 * [(m
c * Ceqcm * fmC)Comb Modules + (ms * Ceqsm *
fmS)Seq Modules + (n * Ceqi * fn)Input Buffers + (0.5 * (q1 *
Ceqcr * fq1) + (r1 * fq1))RCLKA + (0.5 * (q2 * Ceqcr * fq2) +
(r2 * fq2))RCLKB + (0.5 * (s1 * Ceqhv * fs1)+(Ceqhf *
fs1))HCLK] + VCCI
2 * [(p * (C
eqo + CL) * fp)Output Buffers]
where:
The eX, SX-A and RTSX-S Power Calculator can be used to
estimate the total power dissipation (static and dynamic)
of eX devices and can be found at
http://www.actel.com/products/rescenter/power/
calculators.aspx.
Junction Temperature
The temperature variable in the Designer software refers
to
the
junction
temperature,
not
the
ambient
temperature. This is an important distinction because the
heat generated from dynamic power consumption is
usually hotter than the ambient temperature. EQ 1-1,
shown below, can be used to calculate junction
temperature. Please refer to Table 1-9 on page 1-12 for
the recommended operating conditions.
EQ 1-1
Junction Temperature =
∆T + T
a(1)
Where:
Ta = Ambient Temperature
∆T = Temperature gradient between junction (silicon)
and ambient =
θ
ja * P
P = Power
θ
ja = Junction to ambient of package. θja numbers are
located in the "Package Thermal Characteristics" section
on page 1-16.
Table 1-11 • Capacitance of Clock Components of eX
Devices
eX64
eX128
eX256
Dedicated array clock –
variable (Ceqhv)
0.85 pF
0.85 pF
0.85 pF
Dedicated array clock – fixed
(Ceqhf)
18.00 pF
20.00 pF
25.00 pF
Routed array clock A (r1)
23.00 pF
28.00 pF
35.00 pF
Routed array clock B (r2)
23.00 pF
28.00 pF
35.00 pF
mc
= Number of combinatorial cells switching at
frequency fm, typically 20% of C-cells
ms
= Number of sequential cells switching at
frequency fm, typically 20% of R-cells
n
= Number
of
input
buffers
switching
at
frequency fn, typically number of inputs / 4
p
= Number of output buffers switching at
frequency fp, typically number of outputs / 4
q1
= Number of R-cells driven by routed array
clock A
q2
= Number of R-cells driven by routed array
clock B
r1
= Fixed capacitance due to routed array clock A
r2
= Fixed capacitance due to routed array clock B
s1
= Number of R-cells driven by dedicated array
clock
Ceqcm = Equivalent capacitance of combinatorial
modules
Ceqsm = Equivalent capacitance of sequential modules
Ceqi
= Equivalent capacitance of input buffers
Ceqcr = Equivalent capacitance of routed array clocks
Ceqhv = Variable capacitance of dedicated array clock
Ceqhf = Fixed capacitance of dedicated array clock
Ceqo
= Equivalent capacitance of output buffers
CL
= Average output loading capacitance, typically
10pF
fmc
= Average C-cell switching frequency, typically
F/10
fms
= Average R-cell switching frequency, typically
F/10
fn
= Average input buffer switching frequency,
typically F/5
fp
= Average output buffer switching frequency,
typically F/5
fq1
= Frequency of routed clock A
fq2
= Frequency of routed clock B
fs1
= Frequency of dedicated array clock



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