eX Automotive Family FPGAs

1- 16

v3.2

Package Thermal Characteristics

The device junction-to-case thermal characteristic is

θ

and the junction-to-ambient air characteristic is

θ

thermal characteristics for

θ

different air flow rates.

θ

The maximum junction temperature is 150

°C.

The maximum power dissipation allowed for eX devices

is a function of

θ

maximum power dissipation allowed for a TQFP 100-pin

package at automotive temperature and still air is as

follows:

Table 1-12 • Package Thermal Characteristics

Package Type

Pin Count

θ

jc

θ

ja

Units

Still Air

θ

θ

Thin Quad Flat Pack

64

12.0

42.4

36.3

34.0

°C/W

Thin Quad Flat Pack

100

14.0

33.5

27.4

25.0

°C/W

Chip-Scale Package

49

72.2

59.5

54.1

°C/W

Chip-Scale Package

128

54.1

44.6

40.6

°C/W

Chip-Scale Package

180

57.8

47.6

43.3

°C/W

Maximum Power Allowed

Max. junction temp. (

°C) Max. ambient temp. (°C)

–

θ

---------------------------------------------------------------------------------------------------------------------------------

150

°C 125°C

–

33.5

°C/W

--------------------------------------

0.746 W

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