Electronic Components Datasheet Search
  English  ▼

X  

LTM4616 Datasheet(PDF) 18 Page - Linear Technology

Part # LTM4616
Description  Dual 8A per Channel Low VIN DC/DC 關Module
PDF  24 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTM4616 Datasheet(HTML) 18 Page - Linear Technology

Back Button LTM4616 Datasheet HTML 14Page - Linear Technology LTM4616 Datasheet HTML 15Page - Linear Technology LTM4616 Datasheet HTML 16Page - Linear Technology LTM4616 Datasheet HTML 17Page - Linear Technology LTM4616 Datasheet HTML 18Page - Linear Technology LTM4616 Datasheet HTML 19Page - Linear Technology LTM4616 Datasheet HTML 20Page - Linear Technology LTM4616 Datasheet HTML 21Page - Linear Technology LTM4616 Datasheet HTML 22Page - Linear Technology Next Button
Zoom Inzoom in Zoom Outzoom out
 18 / 24 page
background image
LTM4616
18
4616fa
APPLICATIONS INFORMATION
Table 4. 1.2V Output
DERATING CURVE
VIN (V)
POWER LOSS CURVE
AIR FLOW (LFM)
HEAT SINK
θJA (°C/W)
Figures 10, 13
3.3, 5
Figures 7, 8
0
None
10.5
Figures 10, 13
3.3, 5
Figures 7, 8
200
None
8.0
Figures 10, 13
3.3, 5
Figures 7, 8
400
None
7.0
Figures 12, 15
3.3, 5
Figures 7, 8
0
BGA Heat Sink
9.5
Figures 12, 15
3.3, 5
Figures 7, 8
200
BGA Heat Sink
6.3
Figures 12, 15
3.3, 5
Figures 7, 8
400
BGA Heat Sink
5.2
Table 5. 3.3V Output
DERATING CURVE
VIN (V)
POWER LOSS CURVE
AIR FLOW (LFM)
HEAT SINK
θJA (°C/W)
Figure 9
5
Figure 8
0
None
10.5
Figure 9
5
Figure 8
200
None
8.0
Figure 9
5
Figure 8
400
None
7.0
Figure 11
5
Figure 8
0
BGA Heat Sink
9.8
Figure 11
5
Figure 8
200
BGA Heat Sink
7.0
Figure 11
5
Figure 8
400
BGA Heat Sink
5.5
Safety Considerations
The LTM4616 modules do not provide isolation from VIN
to VOUT. There is no internal fuse. If required, a slow blow
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic
failure. The device does support thermal shutdown and
overcurrent protection.
Layout Checklist/Example
The high integration of LTM4616 makes the PCB board
layout very simple and easy. However, to optimize
its electrical and thermal performance, some layout
considerations are still necessary.
• Use large PCB copper areas for high current paths,
including VIN1, VIN2, PGND1 and PGND2, VOUT1 and
VOUT2. It helps to minimize the PCB conduction loss
and thermal stress.
Figure 15. 3.3VIN 1.2VOUT with BGA Heatsink
Figure 16. 3.3VIN 2.5VOUT with BGA Heatsink
Heatsink Manufacturer
Wakefield Engineering
Part No: LTN20069
Phone Number: 603-635-2800
AAVID Thermalloy
Part No: 375424B000346
Phone Number: 603-224-9988
AMBIENT TEMPERATURE (°C)
40
8
10
12
120
4616 F15
6
4
0
90
100 110
70
80
50
60
2
16
14
0 LFM
200 LFM
400 LFM
AMBIENT TEMPERATURE (°C)
30
8
10
12
110
4616 F16
6
4
0
90
70
50
2
16
14
0 LFM
200 LFM
400 LFM



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com