| Electronic Components Datasheet Search |
|
TLV5535IPW Datasheet(PDF) 16 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
TLV5535IPW Datasheet(HTML) 16 Page - Texas Instruments |
|
16 / 32 page ![]() TLV5535 8-BIT, 35 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER SLAS221 – JUNE 1999 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PRINCIPLE OF OPERATION digital inputs (continued) The CLK signal at high frequencies should be considered as an analog input. Overshoot/undershoot should be minimized by proper termination of the signal close to the TLV5535. An important cause of performance degradation for a high-speed ADC is clock jitter. Clock jitter causes uncertainty in the sampling instant of the ADC, in addition to the inherent uncertainty on the sampling instant caused by the part itself, as specified by its aperture jitter. There is a theoretical relationship between the frequency (f) and resolution (2N) of a signal that needs to be sampled and the maximum amount of aperture error dtmax that is tolerable. The following formula shows the relation: dtmax + 1 B p f2 N )1 As an example, for an 8-bit converter with a 15-MHz input, the jitter needs to be kept < 41 pF in order not to have changes in the LSB of the ADC output due to the total aperture error. digital outputs The output of the TLV5535 is standard binary code. Capacitive loading on the output should be kept as low as possible (a maximum loading of 10 pF is recommended) to provide the best performance. Higher output loading causes higher dynamic output currents and can increase noise coupling into the analog front end of the device. To drive higher loads, the use of an output buffer is recommended. When clocking output data from the TLV5535, it is important to observe its timing relation to CLK. The pipeline ADC delay is 4.5 clock cycles to which the maximum output propagation delay is added. See Note 6 in the specification section for more details. layout, decoupling and grounding rules It is necessary for any PCB using the TLV5535 to have proper grounding and layout to achieve the stated performance. Separate analog and digital ground planes that are spliced underneath the device are advisable. The TLV5535 has digital and analog terminals on opposite sides of the package to make proper grounding easier. Since there is no internal connection between the analog and digital grounds, they have to be joined on the PCB. Joining the digital and analog grounds at a point in close proximity to the TLV5535 is advised. As for power supplies, separate analog and digital supply terminals are provided on the device (AVDD/DVDD). The supply to the digital output drivers is kept separate also (DRVDD). Lowering the voltage on this supply from the nominal 3.3 V to 3 V improves performance because of the lower switching noise caused by the output buffers. Due to the high sampling rate and switched-capacitor architecture, the TLV5535 generates transients on the supply and reference lines. Proper decoupling of these lines is essential. Decoupling as shown in the schematic of the TLV5535 EVM is recommended. |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |