DRAM

DRAM

DRAM

DRAM

DRAM

MT4C4001J

MT4C4001J

Rev. 2.2 06/05

AustinSemiconductor,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.

17

Austin Semiconductor, Inc.

ASI Case #504 (Package Designator ECJ)

MECHANICAL DEFINITION*

*All measurements are in inches.

NOTE: The Difference between the ECJ & ECJA packages is that the ECJA has different lead

attach with 5% Sn / 95% Pb solder connection whereas the ECJ package uses compression

weld lead attach. Both package’s lead material is JEDEC TYPE MO-110 option A ‘J’ Form

Copper material.

MIN

MAX

A

0.12

0.14

A1

b

0.012 DIA

0.016 DIA

b1

b2

0.09

0.110

D

0.665

0.685

D1

0.592

0.608

E

0.345

0.355

E1

0.300

0.315

e

0.045

0.055

L

0.055

0.065

SYMBOL

ASI SPECIFICATIONS

0.050 TYP

0.035 TYP