SA7269

HANGZHOU SILAN MICROELECTRONICS CO.,LTD

REV:1.2

2006.05.25

Http: www.silan.com.cn

Page 4 of 11

PIN DESCRIPTION

Pin No.

HSIP-11

HSIP-15

Pin Name

I/O

Pin Description

1

2

-Vs

--

Negative power

2

3

OUT 1

O

Output1

3

5

+Vs

--

Positive power

4

6

OUT 2

O

Output2

5

7

MUTE / ST-BY

I

Mute /stand-by function

6

8

-Vs

--

Negative power

7

9

IN+(2)

I

Inverting Input 2

8

10

IN-(2)

I

Non inverting input 2

9

12

GND

--

Ground

10

13

IN-(1)

I

Non inverting input 1

11

14

IN+(1)

I

Inverting input 1

1,4,11,15

NC

--

Not connected

FUNCTION DESCRIPTION

MUTE STAND-BY FUNCTION

The MUTE/ST-BY controls the amplifier status by two different thresholds, referred to +Vs.

Ø

When MUTE/ST-BY higher than = +Vs - 2.5V the amplifier is in Stand-by mode and the final stage

generators are off.

Ø

When MUTE/ST-BY is between +Vs - 2.5V and +Vs- 6V the final stage current generators are

switched on and the amplifier is in mute mode

Ø

When MUTE/ST-BY is lower than +Vs - 6V the amplifier is play mode.

Power Dissipation and Heat Sinking

The SA7269 must always be operated with a heat sink. In order to determine the appropriate heat sink for a

given application, the power dissipation of the SA7269 in that application must be known. When the load is

resistive, the maximum average power that the IC will be required to dissipate is approximately:

Where VS is the total power supply voltage across the SA7269, RL is the load resistance PQ is the quiescent

power dissipation of the amplifier. The above equation is only an approximation which assume an “ideal”class B

output stage and constant power dissipation in all other parts of the circuit. The curves of “Power Dissipation vs.

Power Output”give a better representation of the behavior of the SA7269 with various power supply voltages and

resistive loads. As an example, if the SA7269is operated on a ±14V power supply with a resistive load of 8

Ω, it

can develop up to 11.5W of internal power dissipation. If the die temperature is to remain below 150

°C for

ambient temperatures up to 50

°C, the total junction-to-ambient thermal resistance must be less than:

(150

°C 50°C)/11.5W 8.7°C/W

Using Rth(j-c) = 2

°C /W, the sum of the case-to-heat-sink interface thermal resistance and the heat-sink-to-

ambient thermal resistance must be less than 6.7

°C/W. The case-to-heat-sink thermal resistance of the HSIP-11