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MIC3232YMM Datasheet(PDF) 16 Page - Micrel Semiconductor |
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MIC3232YMM Datasheet(HTML) 16 Page - Micrel Semiconductor |
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16 / 20 page ![]() Micrel, Inc. MIC3230/1/2 January 2009 16 M9999-011409-A ⎟ ⎟ ⎠ ⎞ ⎜ ⎜ ⎝ ⎛ + = 12 2 _ 2 _ _ PP L AVE IN RMS FET I I D I The switching losses occur during the switching transitions of the FET. The transition times, ttransition, are ere are the times when the FET is turning off and on. Th two transition times per period, T. It is important not to confuse T (the period) with the transition time, ttransition. Eq. (24) Fsw T 1 = Eq. (25) SW transition OUT AVE FET SWITCH FET F t V I P × × × = max _ max _ max _ _ max _ _ max _ transition t : To find Eq. (26) Igatedrv Qg ttransition ≈ max _ is the total gate c rge of the external MOSFET provided by the MOSFET manufacturer and charge at a where Qg ha the Qg ould chosen at a VGS≈10V. This is not an exact value, but is more of an estimate of max _ transition t . The FET manufacturers’ provide a gate specified VGS voltage: sh GS G In Q C _ = FET V @ This is the FET’s input capacitance. Select a FET with RDS(on) and QG such that the external power is below harge=68nC (typical) The perature. As the erature at 125°C is: ation 23: about 0.7W for a SO-8 or about 1W for a PowerPak (FET package). The Vishay Siliconix Si7148DP in a PowerPak SO-8 package is one good choice. The internal gate driver in the MIC3230/1/2 is 2A. From the Si7148DP data sheet: RDS(on)_25°C=0.0145Ω Total gate C ) is a function of tem ( ( temp R on DS ) in the FET increases so does the temp RDS(on). To find ) ( ) ( temp R on DS use Equation 27, or simply o o double the ) for ) 125 ( ) ( C R on DS . Eq. (27) (on DS R 25 ( ) ( C R on DS ) 007 . 1 ( ) 25 ( ) ( ) 25 ( ) ) ( o o − × = Temp on DS C R temp The ( RDS ) ( ) temp on Ω ≈ − ∗ m C RDSon 30 ) 7 ) 125 ( ) 25 125 ( o o × = 00 . 1 ( 0145 . 0 From Equ mW m P COND FET 62 30 64 . 1 2 _ = Ω × = From Equation 26: ns A nC Igatedrv Qg ttransition 34 2 68 = = ≈ A AVE 64 . 1 max _ _ = IFET V VOUT 28 max _ = From Equation 25: Watts kHz ns V A 78 . 0 500 34 28 64 . 1 P SWITCH FET max _ _ = × × × = From Equation 22 W W mW 84 . 0 78 . 0 62 = + PFET = This about the limit for a part on a circuit board without having to use any additional heat sinks. is best used here because of the lower d the low reverse recovery time. The Rectifier Diode A Schottky Diode forward voltage an voltage stress on the diode is the max VOUT and therefore a diode with a higher rating than max VOUT should be used. An 80% de-rating is recommended here as well. Eq (28) ⎟ ⎟ ⎠ ⎞ ⎛ 2 _ diode I I ⎜ ⎜ ⎝ + − = 12 ) 1 ( _ 2 max _ _ max _ PP L AVE IN RMS I D Eq. (29) W P I V P diode RMS diode SCHOTTKY diode 81 . 0 max _ _ ≈ × ≈ MIC3230 power losses IC3230are: is the total gate charge of the The power losses in the M Eq.(30) F V Q P gate gate MIC × × = 3230 Vin IQ × + where gat Q external e T. r ati MOSFE gate V is the gate drive voltage of the MIC3230. F is the switching frequency. Q I is the quiescent cu rent of the MIC3230 found in th lectrical characteriz on table. mA IQ 2 . 3 = . VIN is the voltage at the VIN pin of the MIC3230. From Eq.(30) mA kHz nF PMIC 14 2 . 3 500 12 68 3230 e e W 45 . 0 = × + × × = |
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