LT3050

19

3050f

PACKAGE DESCRIPTION

2.00 ±0.10

(2 SIDES)

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAG

0.40 ± 0.10

BOTTOM VIEW—EXPOSED PAD

0.64 ± 0.10

(2 SIDES)

0.75 ±0.05

R = 0.115

TYP

R = 0.05

TYP

2.39 ±0.10

(2 SIDES)

3.00 ±0.10

(2 SIDES)

1

6

12

7

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0 – 0.05

(DDB12) DFN 0106 REV Ø

0.23 ± 0.05

0.45 BSC

PIN 1

R = 0.20 OR

0.25

45°

CHAMFER

0.25 ± 0.05

2.39 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.64 ±0.05

(2 SIDES)

1.15 ±0.05

0.70 ±0.05

2.55 ±0.05

PACKAGE

OUTLINE

0.45 BSC

MSOP (MSE12) 0608 REV B

0.53

0.152

(.021

.006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.86

(.034)

REF

0.650

(.0256)

BSC

12

12 11 10 9 8 7

7

DETAIL “B”

1

6

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

0.254

(.010)

0 – 6 TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

RECOMMENDED SOLDER PAD LAYOUT

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.845

0.102

(.112

.004)

2.845

0.102

(.112

.004)

4.039

0.102

(.159

.004)

(NOTE 3)

1.651

0.102

(.065

.004)

0.1016

0.0508

(.004

.002)

12 3 4 5 6

3.00

0.102

(.118

.004)

(NOTE 4)

0.406

0.076

(.016

.003)

REF

4.90

0.152

(.193

.006)

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.12 REF

0.35

REF

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889

0.127

(.035

.005)

0.42

0.038

(.0165

.0015)

TYP

0.65

(.0256)

BSC

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

MSE Package

12-Lead Plastic MSOP Exposed Die Pad

(Reference LTC DWG # 05-08-1666 Rev B)

DDB Package

12-Lead Plastic DFN (3mm × 2mm)

(Reference LTC DWG # 05-08-1723 Rev Ø)