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33899 Datasheet(PDF) 9 Page - Freescale Semiconductor, Inc

Part # 33899
Description  Programmable H-Bridge Power IC
PDF  26 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

33899 Datasheet(HTML) 9 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
Freescale Semiconductor
9
33899
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics at -40
°C ≤ TA ≤ 125°C, 4.75V ≤ VCC ≤ 5.25V, 6.0V ≤ VIGNP ≤ 26.5V, unless otherwise noted. Typical values
reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
PWM Frequency(8)
fPWM
–
–
11
kHz
PWM/Output Duty Cycle Accuracy
Frequency = 10kHz, RS = 10k
Ω, Slew Time = 1X, Duty cycle = 50%
OUTACC
-4.5
–
4.5
%
Short-circuit Filter (S0 and S1)
tSCF
4.0
–
11
μs
Minimum PWM Low Pulse Width
PWMMIN
–
–
0.2
μs
Low Side Comparator One Shot
Pulse Duration After a Low Side Comparator Trip
tLSC
5.0
–
10
μs
Low Side Comparator Blank Time
Blanking Time After a Low Side Comparator Pulse(9)
tLSCB
5.0
–
10
μs
Over-temperature Shutdown Filter (time before Die Temp bit is set)(8)
tOTF
5.0
–
13.5
μs
Enable Lead Time(8)
tLEAD
140
–
–
ns
Enable Lag Time(8)
tLAG
50
–
–
ns
Delay Until Output Shuts OFF
Short-circuit Detection or EN1 Falling or EN2 Falling Until H-Bridge Disables
tSODLY
–
–
6.0
μs
Delay Until Output Turns ON
EN1 rising or EN2 rising Until H-Bridge Enables
tENDLY
–
–
5.0
μs
Dead Timer(9)
Time Between High Side MOSFET and Low Side MOSFET Transition
tDEAD
1.0
–
3.0
μs
Open Load Fault Delay
Duration of Fault Condition Until Fault Gets Latched In
tFDO
175
–
400
μs
Over-voltage Shutdown Filter
Time from VIGNP > VOV to MOSFET Output Disable
tOVS
100
–
200
μs
Sleep Recovery Time(8),(9),(10)
tSLEEP
–
150
–
μs
Slew Time S0 and S1(11)
(Output Load = 5.0mH and 1.6
Ω, 30% to 70%, VIGNP = 14.5V)
Slew Mode = 1X
RS= 50k
Ω
RS = 10k
Ω, Short
Slew Mode = 2X
RS = 50k
Ω
RS = 10k
Ω, Short
Slew Mode = 4X
RS = 50k
Ω
RS = 10k
Ω, Short
S0/S1RS
1.6
0.2
2.8
0.5
5.0
1.2
–
–
–
–
–
–
3.2
0.8
6.3
1.5
12.8
3.0
μs
Notes
8.
Design information
9.
Guaranteed by characterization, not production tested.
10.
Sleep recovery time is the time from EN going high until the outputs are ready to respond to input. This time is dependent on the recovery
time of VCCL and VCCL_POR. The recommended value for the VCCL capacitor is designed to permit initialization of internal logic prior to
clearing of the POR condition (See +3.3V Input (VCCL) on page 12).
11.
By design, if the RS input is left open, the slew time is the same as when shorted to GND. However, this is a high-impedance input and
will be susceptible to external noise sources unless terminated appropriately. It is highly recommended to terminate this pin with either
a ground or one of the program resistors .



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