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ST7625 Datasheet(PDF) 2 Page - Sitronix Technology Co., Ltd. |
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ST7625 Datasheet(HTML) 2 Page - Sitronix Technology Co., Ltd. |
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2 / 160 page  ST7625 Ver 1.6 2/160 2008/07 3. ST7625 Pad Arrangement (COG) Chip Size : 9,930 um x 820 um Bump Pitch : PAD NO. 1 ~ 30, 143 ~ 514 : 27 um (COM/SEG) PAD NO. 31 ~ 142 : 80 um (I/O) Bump Size : PAD NO. 1 ~ 25, 148 ~ 172 : 120.5 um(x) ~ 15 um(y) (COM) PAD NO. 26 ~ 30, 143 ~ 147, 173 ~ 514 : 15 um(x) ~ 120.5 um(y) (COM/SEG) PAD NO. 31 ~ 142 : 65 um(x) ~ 63 um(y) (I/O) Bump Height : 15 um 32.41 20 52.41 41.78 30 11.78 62.77 32.77 30 Unit : um Unit : um Unit : um 120.5 15 63 Unit : um Bump size of PAD 31~142 Bump size of PAD 1~25 PAD 148~172 Bump size of PAD 26~30 PAD 143~147 PAD 173~514 (2288,-65) (4693,127) (-4528.36,-351.73) |
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