PCA9536_5

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 05 — 25 January 2010

16 of 22

NXP Semiconductors

PCA9536

Fig 18. Package outline SOT908-1 (HVSON8)

0.5

0.2

1

0.05

0.00

A1

Eh

b

UNIT

y

e

1.5

e1

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

3.1

2.9

cDh

1.65

1.35

y1

3.1

2.9

2.25

1.95

0.3

0.2

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT908-1

MO-229

0.5

0.3

L

0.1

v

0.05

w

SOT908-1

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm

max.

05-09-26

05-10-05

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

X

terminal 1

index area

B

A

D

E

detail X

A

c

C

y

C

exposed tie bar (4

×)

exposed tie bar (4

×)

b

terminal 1

index area

e

A

C

B

C

L

14

5

8

0

1

2 mm

scale