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CHA2295 Datasheet(PDF) 6 Page - United Monolithic Semiconductors |
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CHA2295 Datasheet(HTML) 6 Page - United Monolithic Semiconductors |
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6 / 7 page ![]() CHA2295 6 -11GHz Buffer Splitter Amplifier Ref. : DSCHA22952240 28-Aug.-02 6/7 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Chip Assembly and Mechanical Data 120pF 120pF RF In RF Out 1 RF Out 2 To Vd DC Drain supply feed To Vg DC Gate supply feed Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended. Bonding pad positions. ( Chip thickness : 100µm. DC pads : 100*100 µm². All dimensions are in micrometers ) |
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