LTC3616 datasheet(4/28 Pages) LINER

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LTC3616

3616f

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LTC3616E is guaranteed to meet performance specifications

over the 0°C to 85°C operating junction temperature range. Specifications

over the –40°C to 125°C operating junction temperature range are

assured by design, characterization and correlation with statistical process

controls. The LTC3616I is guaranteed to meet specifications over the

full –40°C to 125°C operating junction temperature range. Note that

the maximum ambient temperature is determined by specific operating

conditions in conjunction with board layout, the rated package thermal

resistance and other environmental factors.

Note 3: This parameter is tested in a feedback loop which servos VFB to

the midpoint for the error amplifier (VITH = 0.75V).

Note 4: External compensation on ITH pin.

ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating junction

temperature range, otherwise specifications are at TJ = 25°C. VIN = 3.3V, RT/SYNC = SVIN unless otherwise specified (Notes 1, 2, 11).

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

PGOOD

Power Good Voltage Windows

TRACK/SS = SVIN, Entering Window

VFB Ramping Up

VFB Ramping

Down

–3

–6

TRACK/SS = SVIN, Leaving Window

VFB Ramping Up

VFB Ramping

Down

–9

–11

tPGOOD

Power Good Blanking Time

Entering and Leaving Window

105

140

μs

RPGOOD

Power Good Pull-Down On-Resistance

Note 5: Tying the ITH pin to SVIN enables the internal compensation and

AVP mode.

Note 6: Dynamic supply current is higher due to the internal gate charge

being delivered at the switching frequency.

Note 7: See description of the TRACK/SS pin in the Pin Functions section.

Note 8: In sourcing mode the average output current is flowing out of SW

pin. In sinking mode the average output current is flowing into the SW Pin.

Note 9: See description of the MODE pin in the Pin Functions section.

Note 10: Guaranteed by correlation and design to wafer level

measurements for QFN packages.

Note 11: This IC includes overtemperature protection that is intended

to protect the device during momentary overload conditions. Junction

temperature will exceed 125°C when overtemperature protection is active.

Continuous operation above the specified maximum operating junction

temperature may impair device reliability.

TYPICAL PERFORMANCE CHARACTERISTICS V

IN = 3.3V, RT/SYNC = SVIN unless otherwise noted.

Efficiency vs Load Current

Burst Mode Operation (VMODE = 0V)

Efficiency vs Load Current

Burst Mode Operation (VMODE = 0V)

Efficiency vs Load Current

OUTPUT CURRENT (mA)

100

1000

10000

3616 G01

VIN = 2.5V

VIN = 3.3V

VIN = 5V

VOUT = 1.8V

OUTPUT CURRENT (mA)

100

1000

10000

3616 G02

VIN = 2.5V

VIN = 3.3V

VIN = 5V

VOUT = 1.2V

OUTPUT CURRENT (mA)

100

1000

10000

3616 G03

Burst Mode OPERATION

PULSE-SKIPPING

FORCED CONTINUOUS

VOUT = 1.8V, VIN = 3.3V

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