TLC5970RHPR datasheet(3/48 Pages) TI

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TLC5970

www.ti.com

SBVS140 – MARCH 2010

THERMAL INFORMATION

TLC5970

THERMAL METRIC(1)

RHP

UNITS

qJA

Junction-to-ambient thermal resistance(2)

26.7

qJC(top)

Junction-to-case(top) thermal resistance (3)

11.7

qJB

Junction-to-board thermal resistance (4)

5.3

°C/W

yJT

Junction-to-top characterization parameter (5)

0.4

yJB

Junction-to-board characterization parameter (6)

5.2

qJC(bottom)

Junction-to-case(bottom) thermal resistance (7)

1.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard

test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7).

(6)

The junction-to-board characterization parameter, yJB estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7).

(7)

The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

DISSIPATION RATINGS

DERATING FACTOR

POWER RATING

PACKAGE

ABOVE TA = +25°C

TA < +25°C

TA = +70°C

TA = +85°C

HTSSOP-32

42.5 mW/°C

5318 mW

3403 mW

2765 mW

with PowerPAD soldered(1)(2)

HTSSOP-32

22.5 mW/°C

2820 mW

1805 mW

1466 mW

with PowerPAD unsoldered(2)(3)

QFN-28

33.2 mW/°C

4149 mW

2655 mW

2157 mW

bottom side heat sink soldered(4)

(1)

With PowerPAD soldered onto copper area on printed circuit board (PCB); 2-oz. copper. For more information, see application report

SLMA002, PowerPAD Thermally-Enhanced Package (available for download at www.ti.com).

(2)

Product preview device.

(3)

With PowerPAD not soldered onto copper area on PCB.

(4)

The package thermal impedance is calculated in accordance with JESD51-5.

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