AM1707 datasheet(194/198 Pages) TI

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AM1707

( )

ZKB

( )

PREFIX

X = Experimental Device

P = Prototype Device

Blank = Production Device

DEVICE

SILICON REVISION

3 = 375 MHz

4 = 456 MHz

Blank

PACKAGE TYPE

256 Pin Plastic BGA, with Pb-free

Soldered Balls [Green]

ZKB =

DEVICE SPEED RANGE

TEMPERATURE RANGE (JUNCTION)

= Silicon Revision 2.0

= 0°C to 90°C (Commercial Grade)

= -40°C to 90°C (Industrial Grade)

= -40°C to 105°C( Extended Grade)

= -40°C to 125°C( Automotive Grade)

AM1707

SPRS637A – FEBRUARY 2010 – REVISED APRIL 2010

www.ti.com

Mechanical Packaging and Orderable Information

This section describes the device orderable part numbers, packaging options, materials, thermal and

mechanical parameters.

8.1

Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all

AM1xxx processors and support tools. Each commercial AM1xxx platform member has one of three

prefixes: X, P, or null (no prefix). Texas Instruments recommends two of three possible prefix designators

for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product

development from engineering prototypes (TMDX) through fully qualified production devices/tools (TMDS).

Device development evolutionary flow:

Experimental device that is not necessarily representative of the final device's electrical

specifications.

Final silicon die that conforms to the device's electrical specifications but has not completed

quality and reliability verification.

NULL

Fully-qualified production device.

Support tool development evolutionary flow:

TMDX

Development-support product that has not yet completed Texas Instruments internal

qualification testing.

TMDS

Fully qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

NULL devices and TMDS development-support tools have been characterized fully, and the quality and

reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production

devices. Texas Instruments recommends that these devices not be used in any production system

because their expected end-use failure rate still is undefined. Only qualified production devices are to be

used.

Figure 8-1 provides a legend for reading the device.

Figure 8-1. Device Nomenclature

8.2

Thermal Data for ZKB

The following table(s) show the thermal resistance characteristics for the PBGA–ZKB mechanical

package.

194

Mechanical Packaging and Orderable Information

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