AM1707 datasheet(195/198 Pages) TI

195 / 198 page

AM1707

www.ti.com

SPRS637A – FEBRUARY 2010 – REVISED APRIL 2010

Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZKB]

PARAMETER

°C/W(1)

°C/W(2)

AIR FLOW (m/s)(3)

ΘJC

Junction-to-case

12.8

13.5

N/A

ΘJB

Junction-to-board

15.1

19.7

N/A

ΘJA

Junction-to-free air

24.5

33.8

0.00

21.9

0.50

21.1

28.7

1.00

ΘJMA

Junction-to-moving air

20.4

27.4

2.00

19.6

4.00

0.6

0.8

0.00

0.8

0.50

PsiJT

Junction-to-package top

0.9

1.2

1.00

1.1

1.4

2.00

1.3

1.8

4.00

14.9

19.1

0.00

14.4

18.2

0.50

PsiJB

Junction-to-board

14.4

1.00

14.3

17.7

2.00

14.1

17.4

4.00

(1)

These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.

For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment

Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount

Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and

1.5oz (50um) inner copper thickness

(2)

Simulation data, using the same model but with 1oz (35um) top and bottom copper thickness and 0.5oz (18um) inner copper thickness.

Power dissipation of 1W and ambient temp of 70C assumed.

(3)

m/s = meters per second

8.3

Mechanical Drawings

This section contains mechanical drawings for the device.

Mechanical Packaging and Orderable Information

195

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