OPA330

OPA2330

OPA4330

SBOS432D – AUGUST 2008 – REVISED JUNE 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

SOT23-5

DBV

OCFQ

SC70-5

DCK

CHL

OPA330

SOIC-8

D

O330A

WCSP-5

YFF

OEH

SOIC-8

D

O2330A

OPA2330

DFN-8

DRB

OCGQ

MSOP-8

DGK

OCGQ

SOIC-14

D

O4330A

OPA4330

TSSOP-14

PW

O4330A

OPA4330

RGY

4330A

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at ti.com.

(2)

Product preview device.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

OPA330, OPA2330, OPA4330

UNIT

+7

V

(V–) –0.3 to (V+) + 0.3

V

±10

mA

Continuous

Operating Temperature

–40 to +150

°C

Storage Temperature

–65 to +150

°C

Junction Temperature

+150

°C

Human Body Model (HBM)

4000

V

ESD

Charged Device Model (CDM)

1000

V

Ratings:

Machine Model (MM)

400

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should

be current limited to 10mA or less.

(3)

Short-circuit to ground, one amplifier per package.

THERMAL INFORMATION

OPA330AIYFF

YFF

UNITS

5 PINS

Junction-to-ambient thermal resistance

130

Junction-to-case (top) thermal resistance

54

Junction-to-board thermal resistance

51

°C/W

Junction-to-top characterization parameter

1

Junction-to-board characterization parameter

50

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Product Folder Link(s): OPA330 OPA2330 OPA4330