ADS6445 datasheet(3/80 Pages) TI

3 / 80 page

ADS6445, ADS6444

ADS6443, ADS6442

www.ti.com

SLAS531B – MAY 2007 – REVISED DECEMBER 2009

PACKAGE/ORDERING INFORMATION(1)

SPECIFIED

TRANSPORT

PACKAGE

PRODUCT

PACKAGE-LEAD

TEMPERATURE

ORDERING NUMBER

MEDIA,

DESIGNATOR

MARKING

RANGE

QUANTITY

ADS6445IRGCT

250, Tape/reel

ADS6445

QFN-64(2)

RGC

–40°C to 85°C

AZ6445

ADS6445IRGCR

2000, Tape/reel

ADS6444IRGCT

250, Tape/reel

ADS6444

QFN-64(2)

RGC

–40°C to 85°C

AZ6444

ADS6444IRGCR

2000, Tape/reel

ADS6443IRGCT

250, Tape/reel

ADS6443

QFN-64(2)

RGC

–40°C to 85°C

AZ6443

ADS6443IRGCR

2000, Tape/reel

ADS6442IRGCT

250, Tape/reel

ADS6442

QFN-64(2)

RGC

–40°C to 85°C

AZ6442

ADS6442IRGCR

2000, Tape/reel

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

For thermal pad size on the package, see the mechanical drawings at the end of this data sheet.

θJA = 23.17 °C/W (0 LFM air flow), θJC

= 22.1 °C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in. x 3 in. PCB.

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

AVDD

Supply voltage range

–0.3 to 3.9

LVDD

Supply voltage range

–0.3 to 3.9

Voltage between AGND and DGND

–0.3 to 0.3

Voltage between AVDD to LVDD

–0.3 to 3.3

Voltage applied to external pin, VCM

–0.3 to 2.0

Voltage applied to analog input pins

–0.3V to minimum ( 3.6, AVDD + 0.3V)

Operating free-air temperature range

–40 to 85

°C

Operating junction temperature range

125

°C

Tstg

Storage temperature range

–65 to 150

°C

Lead temperature 1,6 mm (1/16") from the case for 10 seconds

220

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

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